产品与技术
软硬结合/软板
软硬结合板及软板为将多个刚性电路板组件集成到单个电路板的需求中提供了可靠的解决方案。这些产品还可以减少电路板的整体重量和解决空间要求。
柔性印刷电路板是刚性电路和柔性电路优点的结合。该技术允许用户实现各种优势,如信号传输、稳定性和尺寸。我们是这类板材的领先生产商,拥有广泛的专业知识和产品经验。
我们的工程师能够为客户提供设计指导,并帮助他们找到满足其产品特定需求的最佳解决方案。通过我们在软硬结合板及软板设计领域的丰富经验,我们能够帮助他们提高整体产量并降低生产成本。与客户的密切合作使他们能够创建创新和可持续的解决方案,并帮助客户优化产品设计。
为了应对对柔性印刷电路板日益增长的需求,我们还能够支持核心HDI技术与柔性印刷电路板相结合的批量生产。
技术特点
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软硬结合板技术参数
序号 | 项目名称 | 样板能力 | 批量能力 | ||
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1 | 做板尺寸 | 2层 | 沉金/沉锡 | 250/500*900mm | 250/500*1200mm |
≥4层 | 沉金/沉锡 | 250/500*710mm | 250/500*1200mm | ||
2 | 叠层 | 盲埋孔板类型 | 压板次数 | 最大压板次数≤3times | 最大压板次数≤3times |
铜厚能力 | 内层 | 1/3OZ-2OZ(软板基材最大铜厚) MAX 2OZ |
1/3OZ-2OZ(软板基材最大铜厚) MAX 2OZ |
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外层 | 1/3OZ-3OZmm | 1/3OZ-3OZmm | |||
最小介质厚度 | 0.025mm(软板基材) 0.043mm(硬板基材) |
0.0125mm(软板基材) 0.043mm(硬板基材) |
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最大层数 | 18层 18L |
24层 24L |
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板厚公差 | 板厚≤1.0mm | ±0.1mm | ±0.1mm | ||
板厚>1.0mm | ±10% | ±10% | |||
3 | 线宽/线距 | 内层线宽/线距 | 1/3OZ | 2/2mil | 1.5/1.5mil |
1/2OZ | 2.5/2.5mil | 2/2mil | |||
1OZ | 3.0/3.0mil | 3.0/3.0mil | |||
2OZ | 6/5.5mil | 6/5.5mil | |||
外层线宽/线距 | 1/3OZ | 3/3mil | 3/3mil | ||
1/2OZ | 3.5/3.5mil | 3.5/3.5mil | |||
1OZ | 5/5mil | 5/5mil | |||
2OZ | 6/8mil | 6/8mil | |||
3OZ | 8/11mil | 8/11mil | |||
焊盘公差 | ≤12mil | ±1.2mil | ±1.2mil | ||
>12mil | ±10% | ±10% | |||
4 | 钻孔 | 机械钻咀尺寸 | 0.15-6.35mm | 0.1-6.35mm | |
PTH孔公差 | ±0.075mm | ±0.075mm | |||
NPH孔公差 | ±0.05mm | ±0.05mm | |||
金属化槽孔公差 | 长槽 Long slot |
±0.075mm | ±0.075mm | ||
短槽 Short Slot |
±0.1mm | ±0.1mm | |||
电镀深径比能力 | 孔径=0.15mm | 7:1 | 7:1 | ||
孔径=0.2mm | 10:1 | 10:1 | |||
孔径 ≥0.25mm | 15:1 | 15:1 | |||
背钻能力(背钻,控深钻) | 孔径 | 0.4-6.35mm | 0.4-6.35mm | ||
背钻孔相对于通孔 | 整体大0.2mm | 整体大0.2mm | |||
背钻深度公差 | ±0.1mm | ±0.1mm | |||
Stub长度 | 0.05-0.25 | 0.05-0.25 | |||
5 | 最小BGA能力 | 1.0mm BGA 2 trace | Yes | Yes | |
0.8mm BGA 1 trace | Yes | Yes | |||
0.65mm BGA | Yes | Yes | |||
0.5mm BGA | Yes | Yes | |||
0.4mm BGA | Yes(Sample) | Yes(Sample) | |||
6 | 镭射 | 镭射孔尺寸 | 0.07-0.2mm | 0.05-0.2mm | |
镭射孔径能力 | ≤1:1 | ≤1:1 | |||
7 | 绿油/阻焊 | 颜色 | Green,Yellow,Black,Blue,Red, White, Matt green | Green,Yellow,Black,Blue,Red, White, Matt green | |
绿油厚度 | Single print thickness | 10-30um | 10-30um | ||
Double print thickness | 20-60um | 20-60um | |||
The line corner | ≥5um | ≥5um | |||
最小绿油桥 | 3.0mil,杂色油最小4mil | 3.0mil,杂色油最小4mil | |||
8 | 树脂塞孔 | 树脂塞孔孔径 | 0.15-0.6mm | 0.1-0.6mm | |
树脂塞孔板厚 | 0.3-3.0mm | 0.3-3.0mm | |||
树脂塞孔孔径能力 | 12:1 | 12:1 | |||
9 | 阻抗 | 阻抗能力 | 单线阻抗<50Ω | ±5Ω | ±3.5Ω |
单线阻抗≥50Ω | ±10% | ±7% | |||
差分阻抗 | ±10% | ±7% |
软硬结合板技术参数
序号 | 项目名称 | 样板能力 | 批量能力 | ||
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做板尺寸 | 1层 | 沉金/沉锡 | 250/500宽幅*900mm | 250/500宽幅*1200mm | |
≥4层 | 沉金/沉锡 | 250*800mm | 250*800mm | ||
2 | 叠层 | 盲埋孔板类型 | 压板次数 | 最大压板次数≤2times | 最大压板次数≤2times |
铜厚能力 | 内层 | 1/3OZ-2oz MAX 2OZ |
1/3OZ-2oz MAX 2OZ |
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外层 | 1/3OZ-2OZ | 1/3OZ-3OZ | |||
最小介质厚度 | 0.0125mm | 0.0125mm | |||
最大层数 | 6层 | 8层 | |||
3 | 线宽/线距 | 内层线宽/线距 | 1/3OZ | 2/2mil | 1.5/1.5mil |
1/2OZ | 2.5/2.5mil | 2/2mil | |||
1OZ | 3.0/3.0mil | 3.0/3.0mil | |||
2OZ | 6/5.5mil | 6/5.5mil | |||
外层线宽/线距 | 1/3OZ | 3/3mil | 3/3mil | ||
1/2OZ | 3.5/3.5mil | 3.5/3.5mil | |||
1OZ | 5/5mil | 5/5mil | |||
2OZ | 6/8mil | 6/8mil | |||
3OZ | 8/11mil | 8/11mil | |||
焊盘公差 | ≤12mil | ±1.2mil | ±1.2mil | ||
>12mil | ±10% | ±10% | |||
4 | 钻孔 | 机械钻咀尺寸 | 0.15-6.0mm | 0.1-6.5mm | |
PTH孔公差 | ±0.075mm | ±0.075mm | |||
NPH孔公差 | ±0.05mm | ±0.05mm | |||
金属化槽孔公差 | 长槽 | ±0.075mm | ±0.075mm | ||
短槽 | ±0.1mm | ±0.1mm | |||
5 | 最小BGA能力 | 1.0mm BGA 2 trace | Yes | Yes | |
0.8mm BGA 1 trace | Yes | Yes | |||
0.65mm BGA | Yes | Yes | |||
0.5mm BGA | Yes | Yes | |||
0.4mm BGA | Yes(Sample) | Yes(Sample) | |||
6 | 镭射 | 镭射孔尺寸 | 0.07-0.2mm | 0.05-0.2mm | |
镭射孔径能力 | ≤1:1 | ≤1:1 | |||
7 | 绿油/阻焊 | 颜色 | Green,Yellow,Black,Blue,Red, White, Matt green | Green,Yellow,Black,Blue,Red, White, Matt green | |
绿油厚度 SM ThK |
Single print thickness | 10-30um | 10-30um | ||
最小绿油桥 | 3.0mil,杂色油最小4mil | 3.0mil,杂色油最小4mil | |||
8 | 阻抗 | 阻抗能力 | 单线阻抗<50Ω | ±5Ω | ±3.5Ω |
单线阻抗≥50Ω | ±10% | ±7% | |||
差分阻抗 | ±10% | ±7% | |||
9 | 贴合 | 覆盖膜对位公差 | ±0.15mm | ±0.1mm | |
10 | 贴补强 | 补强对位公差 | ±0.2mm | ±0.15mm | |
11 | 外形 | 激光切割/模冲 | ±0.05mm | ±0.05mm | |
12 | 结构 | Air Gap能力 | Yes | Yes |